DISH Wireless Debtors - Chapter 11 DIP Terms

The DISH Wireless Debtors sought final approval of an up-to-$85 million secured superpriority, multi-draw DIP term loan facility for borrower DISH Wireless L.L.C. from its affiliate/parent EchoStar Corporation—which also agreed to serve as stalking horse bidder—to fund the orderly decommissioning of wireless infrastructure, the administration of the cases, and the RSA-contemplated sale process, priced at 11.50% PIK interest and maturing December 31, 2026, under which EchoStar may credit bid its outstanding DIP obligations against the $300 million cash portion of its purchase price.

DIP Terms

Borrower / Guarantors

DIP Lender

DIP Commitments

Conditions of Borrowing

Use of Proceeds

Interest Rate

Fees

Maturity

Prepayments

Carve Out

Cash Collateral and Cash Management

Credit Bid

Avoidance Actions

Challenge Period

Securities and Priorities

Events of Default

Fiduciary Out

Special Committee Investigation Budget

Permitted Variance

Waivers

Remedies and Modification of the Automatic Stay

Significant Provisions Not Present

Prepetition Capital Structure